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ds-CPC5610/5611-r9.0 www.clare.com 1 features ? full-duplex data and voice transmission ? transformerless telephone line isolation interface ? operates at all modem speeds, including v.90 (56k) ? 3.3 or 5 v power supply operation ? half-wave ring detector (CPC5610) or full-wave ring detector (cpc5611) ? caller id signal reception ? small 32-pin soic plastic package ? printed-circuit board space and cost savings ? meets pc card (pcmcia) height requirements ? easy interface with modem ics and voice codecs ? worldwide dial-up telephone network compatibility ? supplied application circui t complies with the requirements of tia/eia/is-968 (fcc part 68), ul1950, ul60950, en60950, iec60950, en55022b, cispr22b, en55024, and tbr-21 ? CPC5610 and cpc5611 comply with ul1577 ? ttl compatible logic inputs and outputs ? line-side circuit powered from telephone line applications ? satellite and cable set-top boxes ? v.90 (and other standard) modems ? fax machines ? voicemail systems ? computer telephony ? pbxs ? telephony gateways ? embedded modems for such applications as pos terminals, automated banking, remote metering, vending machines, security, and surveillance description clare CPC5610 and cpc5611 litelinks are silicon data access arrangement (daa) ics used in data and voice communication applications to make connec- tions to the public switched telephone network (pstn). litelink uses on-chip optical components and a few inexpensive external components to form a complete voice or high-speed data telephone line interface. litelink eliminates the need for the large isolation transformers or capacitors as used in other daa con- figurations. it incorporates the required high-voltage isolation barrier in the surface-mount soic package. the CPC5610 (half-wave ring detect) and cpc5611 (full-wave ring detect) build upon clares existing litelink line, with improved performance and 3.3 v operation. ordering information figure 1. CPC5610/cpc5611 block diagram part number description CPC5610a 32-pin surface mount daa with half-wave ring detect, tubed CPC5610atr 32-pin surface mount daa with half-wave ring detect, tape and reel cpc5611a 32-pin surface mount daa with full-wave ring detect, tubed cpc5611atr 32-pin surface mount daa with full-wave ring detect, tape and reel transconductance stage 2-4 wire hybrid ac/dc termination hookswitch isolation barrier vref agc vref agc snoop amplifier receive isolation amplifier transmit isolation amplifier tip+ ring- transmit diff. amplifier receive diff. amplifier cid/ ring mux tx+ tx- oh ring cid rx+ rx- current limit control ac impedance control vi slope control c snoop c snoop r snoop r snoop CPC5610/cpc5611 litelink? ii silicon data access arrangement (daa) ic
CPC5610/cpc5611 2 www.clare.com r9.0 1 electrical specifications. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 1.1 absolute maximum ratings. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 1.2 performance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 1.3 pin description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 2 application circuits . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 2.1 resistive termination application circuit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 2.1.1 resistive termination application circuit part list . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 2.2 reactive termination application circuit. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 2.2.1 reactive termination application circuit part list . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 3 using litelink . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 3.1 switch hook control (on-hook and off-hook states) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 3.2 on-hook operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 3.2.1 ring signal detection via the snoop circuit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 3.2.2 polarity reversal detection with cpc5611 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 3.2.3 on-hook caller id signal processing. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 3.3 off-hook operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 3.3.1 receive signal path. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 3.3.2 transmit signal path . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 3.4 dc characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 3.4.1 resistive termination applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 3.4.2 reactive termination applications. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 3.5 ac characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 3.5.1 resistive termination applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 3.5.2 reactive termination applications. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 4 regulatory information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 5 litelink design resources . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 5.1 clare, inc. design resources . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 5.2 third party design resources. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 6 litelink performance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 7 manufacturing information. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 7.1 mechanical dimensions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 7.2 tape and reel packaging . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 7.3 soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 7.3.1 moisture reflow sensitivity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 7.3.2 reflow profile . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 7.4 washing. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
CPC5610/cpc5611 rev. 9.0 www.clare.com 3 1. electrical specifications 1.1 absolute maximum ratings absolute maximum ratings are stress ratings. stresses in excess of these ratings can cause permanent damage to the device. functional operatio n of the device at these or any other conditions beyond t hose indicated in the opera- tional sections of this data sheet is not implied. exposure of the device to the absolute maximum ratings for an extended period may degrade the device and affect its reli- ability. 1.2 performance parameter minimum maximum unit isolation voltage 1500 - v rms continuous tip to ring current (r zdc = 5.2 ? ) 150 ma total package power dis- sipation 1w operating temperature 0 +85 c storage temperature -40 +125 c soldering temperature - +220 c parameter minimum typical maximum unit conditions dc characteristics operating voltage v dd 3.0 - 5.50 v host side operating current i dd - - 10 ma host side operating voltage v ddl 2.8 - 3.2 v line side, derived from tip and ring operating current i ddl - 10.5 12 ma line side, drawn from tip and ring while off-hook on-hook characteristics metallic dc resistance 10 - - m ? tip to ring, 100 vdc applied longitudinal dc resistance 10 - - m ? 150 vdc applied from tip and ring to earth ground ring signal detect level 5 - - v rms 68 hz ring signal applied to tip and ring ring signal detect level 28 - - v rms 15 hz ring signal applied across tip and ring snoop circuit frequency response 166 - >4000 hz -3 db corner frequency @ 166 hz snoop circuit cmrr - -40 - db 120 v rms 60 hz common mode signal across tip and ring ringer equivalence - 0.1b - ren longitudinal balance 60 - - db per fcc part 68.3 off-hook characteristics ac impedance - 600 - ? tip to ring, using resistive termination application circuit longitudinal balance 40 - - db per fcc part 68.3 return loss - 26 - db into 600 ? at 1800 hz transmit and receive characteristics frequency response 30 - 4000 hz -3 db corner frequency 30 hz trans-hybrid loss - 36 - db into 600 ? at 1800 hz, with c18 transmit and receive insertion loss -1 0 1 db 30 hz to 4 khz average in-band noise - -120 - dbm/hz 4 khz flat bandwidth harmonic distortion - -80 - db -3 dbm, 600 hz, 2 nd harmonic
CPC5610/cpc5611 4 www.clare.com rev. 9.0 transmit level - 0 2.2 v p-p single-tone sine wave. or 0 dbm into 600 ? . receive level - - 2.2 v p-p single-tone sine wave. or 0 dbm into 600 ? . rx+/rx- output drive current - - 0.5 ma sink and source tx+/tx- input impedance 60 90 120 k ? isolation characteristics isolation voltage 1500 - - v rms line side to host side surge rise time 2000 - - v/ s no damage via tip and ring oh and cid control logic inputs input threshold voltage 0.8 - 2.0 v high level input current -120 - 0 a v in v dd low level input current - - -120 a v in =gnd ring output logic levels output high voltage v dd -0.4 --v i out = -400 a output low voltage - - 0.4 v i out = 1 ma specifications subject to change without notice. all performanc e characteristics based on the use of clare, inc. application ci rcuits. functional operation of the device at conditions beyond those specified her e is not implied. specification conditions: v dd = 5v, temperature = 25 c, unless otherwise indicated. parameter minimum typical maximum unit conditions
CPC5610/cpc5611 rev. 9.0 www.clare.com 5 1.3 pin description figure 2. pinout pin name function 1 vdd host (cpe) side power supply 2 txsm transmit summing junction 3tx- negative differential transmit signal to daa from host 4tx+ positive differential trans mit signal to daa from host 5 tx transmit differen tial amplifier output 6 refm internal voltage reference 7 gnd host (cpe) side analog ground 8oh assert logic low for off-hook operation 9ring indicates ring signal, pulsed high to low 10 cid assert logic low while on hook to place cid information on rx pins. 11 rx- negative differential analog signal received from the telephone line. must be ac coupled with 0.1 f. 12 rx+ positive differential anal og signal received from the telephone line. must be ac coupled with 0.1 f. 13 snp+ positive differential snoop input 14 snp- negative differential snoop input 15 rxf receive photodiode amplifier output 16 rx receive photodiode summing junction 17 vddl power supply for line side, regulated from tip and ring. 18 rxs receive isolation amp summing junction 19 rpb receive led pre-bias current set 20 br- bridge rectifier return 21 zdc electronic inductor and dc current limit 22 dcs2 dc feedback output 23 dcs1 v to i slope control 24 refb 0.625 vdc reference 25 gat external mosfet gate control 26 nts receive signal input 27 br- bridge rectifier return 28 txsl transmit photodiode summing junction 29 znt receiver impedance set 30 ztx transmit transconductance gain set 31 txf transmit photodiode amplifier output 32 refl 1.25 vdc reference 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 32 31 30 29 28 27 26 25 24 23 22 21 20 19 18 17 vdd txsm tx- tx+ tx refm gnd oh ring cid rx- rx+ snp+ snp- rxf rx refl txf ztx znt txsl br- nts gat refb dcs1 dcs2 zdc br- rpb rxs vddl
CPC5610/cpc5611 6 www.clare.com rev. 9.0 2. application circuits litelink can be used with telephone networks world- wide. some public telephone networks, notably in north america and japan require resistive line temri- nation. other telephone networks in europe and else- where require reactive line termination. the application circuits bel ow address both line termi- nation models. the reactive termination application circuit (see section 2.2 on page 8) describes a tbr-21 implementation. this circ uit can be adapted easily for other reactive termination needs. worldwide applica- tion of litelink is described more fully in clare appli- cation note an-147, worldwide application of litelink . 2.1 resistive termination application circuit figure 3. resistive termination application circuit schematic 1 this design was tested and found to comply with fcc part 68 with this part. other compliance requirements may require a different part. 2 higher-noise power supplies may require substitution of a 220 h inductor, toko 380hb-2215 or similar. see the power quality section of clare applica- tion note an-146, guidelines for effect ive litelink designs for more informa- tion. 3 optional for enhanced trans-hybrid loss, see trans-hybrid loss on page 16. 1 2 + - oh ring cid tx+ rx+ tx- rx- 3.3 or 5 v c13 0.1 c14 0.1 c2 0.1 c3 0.1 c4 0.1 r1 (r ) 80.6k 1% tx r23 10 2 -br -br -br tip ring u1 litelink 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 32 31 30 29 28 27 26 25 24 23 22 21 20 19 18 17 vdd txsm tx- tx+ tx refm gnd rx- rx+ snp+ snp- rxf rx oh ring cid refl txf ztx znt txsl br1- nts gat refb dcs1 dcs2 zdc br2- rpb rxs vddl db1 sizb60 600v_60a sp1 p3100sb 1 -br -br a a a c9 0.1 c16 10 fb1 600 200 ma ? c1 1 r5 (r ) 42.2k 1% txf r13 (r ) 1m 1% nts c10 0.01 500v r15 (r ) 1.69m 1% dcs2 r14 (r ) 47 gat r20 (r ) 2 vddl r21 (r ) 1% dcs1b 6.2 m r22 (r ) 6.8 m 1% dcs1a c12 (c ) 0.027 dcs r2 (r ) 127k 1% rxf r3 (r ) 1.5m 1% snpd c7 (c ) 220pf 2000v snp- c8 (c ) 220pf 2000v snp+ r6 (r ) 1.8m 1/10w 1% snp-2 r44 (r ) 1.8m 1/10w 1% snp-1 r7 (r ) 1.8m 1/10w 1% snp+2 r45 (r ) 1.8m 1/10w 1% snp+1 r4 (r ) 68.1 1% pb r8 (r ) 200k 1% htx r9 (r ) 200k 1% hnt -br note: unless otherwise noted, all resistors are in ohms, 5%. all capacitors are in microfarads. q1 cpc5602c r10 (r ) 301 1% znt r18 (r ) 150 1% ztx r12 (r ) 1m 1% ntf r16 (r ) 8.2 1% zdc -br -br c183 15 pf c15 0.01 500v
CPC5610/cpc5611 rev. 9.0 www.clare.com 7 2.1.1 resistive termination application circuit part list quantity reference designator description suppliers 1c1 1 f, 16 v, 10% panasonic, avx, novacap, murata, smec, etc. 6 c2, c3, c4, c9, c13, c14 0.1 f, 16 v, 10% 2 c7, c8 1 220 pf, 2 kv, 5% 2 c10, c15 1 0.01 f, 500 v, 10% 1 c12 0.027 f, 16 v, 10% 1c16 10 f, 16 v, 10% 1 c18 (optional) 15 pf, 16v, 10% 1 r1 80.6 k ? , 1/16 w, 1% panasonic, electro films, fmi, vishay, etc. 1 r2 127 k ? , 1/16 w, 1% 1 r3 1.5 m ? , 1/16 w, 1% 1 r4 68.1 ? , 1/16 w, 1% 1 r5 42.2 k ? , 1/16 w, 1% 4 r6, r7, r44, r45 1 1.8 m ? , 1/10 w, 1% 2 r8, r9 200 k ? , 1/16 w, 1% 1 r10 301 ? , 1/16 w, 1% 2 r12, r13 1 m ? , 1/16 w, 1% 1r14 47 ? , 1/16 w, 5% 1 r15 1.69 m ? , 1/16 w, 1% 1 r16 8.2 ? , 1/16 w, 1% 1 r18 150 ? , 1/16 w, 1% 1r20 2 ? , 1/16 w, 5% 1 r21 6.2 m ? , 1/16 w, 1% 1 r22 6.8 m ? , 1/16 w, 1% 1r23 10 ? , 1/16 w, 5%, or 220 h inductor 1 fb1 600 ? , 200 ma ferrite bead murata blm11a601s or similar 1 db1 sizb60, 600 v, 60 a bridge rectifier shindengen, diodes, inc. 1 sp1 350 v, 100 a sidactor teccor, st microelectronics, ti 1 q1 cpc5602 fet clare 1 u1 CPC5610 litelink 1 through-hole components offer significant cost savings over smt.
CPC5610/cpc5611 8 www.clare.com rev. 9.0 2.2 reactive termination application circuit figure 4. reactive terminati on application circuit schematic 1 this design was tested and found to comply with fcc part 68 with this part. other compliance requirements may require a different part. 2 higher-noise power supplies may require substitution of a 220 h inductor, toko 380hb-2215 or similar. see the power quality section of clare applica- tion note an-146, guidelines for effect ive litelink designs for more informa- tion. 1 2 + - oh ring cid tx+ rx+ tx- rx- 3.3 or 5 v c13 0.1 c14 0.1 c2 0.1 c3 0.1 c4 0.1 r1 (r ) 80.6k 1% tx r23 10 2 -br -br -br tip ring u1 litelink 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 32 31 30 29 28 27 26 25 24 23 22 21 20 19 18 17 vdd txsm tx- tx+ tx refm gnd rx- rx+ snp+ snp- rxf rx oh ring cid refl txf ztx znt txsl br1- nts gat refb dcs1 dcs2 zdc br2- rpb rxs vddl db1 sizb60 600v_60a sp1 p3100sb 1 -br -br a a a c9 0.1 c16 10 fb1 600 200 ma ? c1 1 r5 (r ) 42.2k 1% txf r13 (r ) 1m 1% nts c10 0.01 500v r15 (r ) 1.69m 1% dcs2 r14 (r ) 47 gat r20 (r ) 2 vddl r21 (r ) 1% dcs1b 6.2 m r22 (r ) 6.8 m 1% dcs1a c12 (c ) 0.027 dcs r2 (r ) 127k 1% rxf r3 (r ) 1.5m 1% snpd c7 (c ) 220pf 2000v snp- c8 (c ) 220pf 2000v snp+ r6 (r ) 1.8m 1/10w 1% snp-2 r44 (r ) 1.8m 1/10w 1% snp-1 r7 (r ) 1.8m 1/10w 1% snp+2 r45 (r ) 1.8m 1/10w 1% snp+1 r4 (r ) 68.1 1% pb r8 (r ) 200k 1% htx r9 (r ) 200k 1% hnt -br note: unless otherwise noted, all resistors are in ohms, 5%. all capacitors are in microfarads. q1 cpc5602c r10 59 1% (r ) znt1 r18 29.4 1% (r ) ztx1 r11 (r ) 169 1% znt2 r19 84.5 1% (r ) ztx2 c20 (c ) 0.68 znt c11 (c ) 1.5 ztx r12 287k 1% (r ) ntf r16 22.1 1% (r ) zdc -br -br -br c15 0.0022 500v -br q2 mmbt4126 r74 10 1% -br c32 0.47
CPC5610/cpc5611 rev. 9.0 www.clare.com 9 2.2.1 reactive termination application circuit part list quantity reference designator description supplier 1c1 1 f, 16 v, 10% panasonic, avx, novacap, murata, smec, etc. 6 c2, c3, c4, c9, c13, c14 0.1 f, 16 v, 10% 1 c5 0.47 f, 16 v, 10% 2 c7, c8 1 220 pf, 2 kv, 5% 2 c10 1 0.01 f, 500 v, 10% 1 c11 1.5 f, 16 v, 10% 1 c12 0.027 f, 16 v, 10% 1 c15 1 0.0022 f, 500 v, 10% 1c16 10 f, 16 v, 10% 1 c20 0.68 f, 16 v, 10% 1 c32 0.47 f, 16 v, 10% 1 r1 80.6 k ? , 1/16 w, 1% panasonic, electro films, fmi, vishay, etc. 1 r2 127 k ? , 1/16 w, 1% 1 r3 1.5 m ? , 1/16 w, 1% 1 r4 68.1 ? , 1/16 w, 1% 1 r5 42.2 k ? , 1/16 w, 1% 4 r6, r7, r44, r45 1 1.8 m ? , 1/10 w, 1% 2 r8, r9 200 k ? , 1/16 w, 1% 1r10 59 ? , 1/16 w, 1% 1 r11 169 ? , 1/16 w, 1% 1 r12 287 k ? , 1/16 w, 1% 1r13 1 m ? , 1/16 w, 1% 1r14 47 ? , 1/16 w, 5% 1 r15 1.69 m ? , 1/16 w, 1% 1r16 22.1 ? , 1/16 w, 1% 1r18 29.4 ? , 1/16 w, 1% 1r19 84.5 ? , 1/16 w, 1% 1r20 2 ? , 1/16 w, 5% 1 r21 6.2 m ? , 1/16 w, 1% 1 r22 6.8 m ? , 1/16 w, 1% 1r23 10 ? , 1/16 w, 5%, or 220 h inductor 1r74 10 ? , 1/16 w, 1% 1 fb1 600 ? , 200 ma ferrite bead murata blm11a601s or similar 1 db1 sizb60, 600 v, 60 a bridge rectifier shindengen, diodes, inc. 1 sp1 350 v, 100 a sidactor teccor, st microelectronics, ti 1 q1 cpc5602 fet clare 1 q2 mmbt4126 fairchild 1 u1 CPC5610 litelink clare 1 through-hole components offer significant cost savings over smt.
CPC5610/cpc5611 10 www.clare.com rev. 9.0 3. using litelink as a full-featured telephone line interface, litelink performs the following functions: ? dc termination ? ac impedance control ? v/i slope control ? 2-wire to 4-wire conversion (hybrid) ? current limiting ? ring detection ? caller id signal reception ? switch hook litelink can accommodate specific application fea- tures without sacrificing basic functionality and perfor- mance. application features include, but are not limited to: ? high gain (+3 dbm) operation ? pulse dialing ? ground start ? loop start ? parallel telephone off-hook detection (911 feature) ? battery reversal ? line presence ? world-wide programmable operation this section of the data sheet describes litelink operation in standard configuration for usual opera- tion. clare offers additional application information on- line (see section 5 on page 14) . these include informa- tion on the following topics: ? circuit isolation considerations ? optimizing litelink performance ? data access arrangement architecture ? litelink circuit descriptions ? surge protection ? emi considerations other specific application materials are also refer- enced in this section as appropriate. 3.1 switch hook control (on-hook and off-hook states) litelink operates in one of two conditions, on-hook and off-hook. in the on-hook condition the telephone line is available for calls. in the off-hook condition the telephone line is engaged. use the oh control input to place litelink in one of these two states. with oh high, litelink is on-hook and ready to make or receive a call. the snoop circuit is enabled. assert oh low to place litelink in the off-hook state. in the off- hook state, loop current flows through litelink and the system is answering or placing a call. 3.2 on-hook operation the litelink application ci rcuit leakage current is less than 10 a with 100 v across ring and tip, equiva- lent to greater than 10 m ? on-hook resistance. 3.2.1 ring signal detection via the snoop circuit in the on-hook state (oh and cid not asserted), an internal multiplexer turns on the snoop circuit. this cir- cuit monitors the telephone line for two conditions; an incoming ring signal, and caller id data bursts. refer to the application schematic diagram (see figure 3 on page 6) . c7 (c snp- ) and c8 (c snp+ ) provide a high-voltage isolation barrier between the telephone line and snp- and snp+ on the litelink while cou- pling ac signals to the snoop amplifier. the snoop cir- cuit snoops the telephone line continuously while drawing no current. in the litelink, ringing signals are compared to a threshold. the comparator output forms the ring signal output from litelink. this sig- nal must be qualified by the host system as a valid ringing signal. a low level on ring indicates that the litelink ring signal threshold has been exceeded. for the CPC5610 (with the half-wave ring detector), the frequency of the ring output follows the fre- quency of the ringing signal from the central office (co), typically 20 hz. the ring output of the cpc5611 (with the full-wave ring detector) is twice the ringing signal frequency. hysteresis is employed in the litelink ring detector circuit to provide noise immunity. the setup of the ring detector comparator causes ring output pulses to remain low for most of the ringing signal half-cycle. the ring output returns high for the entire negative half-cycle of the ringing si gnal for the CPC5610. for the cpc5611, the ring output returns high for a short period near the zero-crossing of the ringing signal before returning low during the positive half-cycle. for both the CPC5610 and cpc5611, the ring output remains high between ringing signal bursts. the ring detection threshold depends on the values of r3 (r snpd ), r6 (r snp- ), r7 (r snp+ ), c7 (c snp- ), and c8 (c snp+ ). the values for these components shown in the typical application circuits are recommended for
CPC5610/cpc5611 rev. 9.0 www.clare.com 11 typical operation. the ring detection threshold can be changed according to the following formula: clare application note an-117 customize caller id gain and ring detect voltage threshold is a spreadsheet for trying different component va lues in this circuit. changing the ring detection threshold will also change the caller id gain and the timing of the polarity reversal detection pulse, if used. 3.2.2 polarity reversal detection with cpc5611 the full-wave ring detector in the cpc5611 makes it possible to detect tip and ri ng polarity reversal using the ring output. when the polarity of tip and ring reverses, a pulse on ring indicates the event. your host system must be able to discriminate this single pulse of approximately 1 msec (using the recom- mended snoop circuit external components) from a valid ringing signal. 3.2.3 on-hook caller id signal processing on-hook caller id (cid) signals are processed by litelink by coupling the cid data burst through the snoop circuit to the litelink rx outputs under con- trol of the cid pin. in north america, cid data signals are typically sent between the first and second ringing signal. figure 5. on-hook calle r id signal timing in north america for CPC5610 (with half- wave ring detect) in north american applications, follow these steps to receive on-hook caller id data via the litelink rx outputs: 1. detect the first ringing signal outputs on ring . 2. assert cid low. 3. process the cid data from the rx outputs. 4. de-assert cid (high or floating). note: taking litelink off-hook (via the oh pin) dis- connects the snoop path from both the receive outputs and the ring output, regardless of the state of the cid pin. cid gain from tip and ring to rx+ and rx- is deter- mined by: where ? is the frequency of the cid data signal. the recommended components in the application cir- cuit yield a gain 0.27 db at 200 hz. clare application note an-117 customize caller id ga in and ring detect voltage threshold is a spreadsheet for trying different component values in this circuit. changing the cid gain will also change the ring detection threshold and the timing of the polarity reversal detection pulse, if used. for single-ended snoop circuit output of 0 dbm, set the total resistance across the series resistors (r6/ r44 and r7/r45) to 1.4 m ?. 3.3 off-hook operation 3.3.1 receive signal path signals to and from the telephone network appear on the tip and ring connections of the application circuit. receive signals are extracted from transmit signals by the litelink two-wire to four-wire hybrid. next, the receive signal is converted to infrared light by the receive photodiode amplifier and receive path led. the intensity of the light is modulated by the receive signal and coupled across the electrical isolation bar- rier by a reflective dome. on the host equipment side of the barrier, the receive signal is converted by a photodiode into a photocur- v ringpk 750 mv r 3 ----------------- ?? ?? 2 r 6 r 3 + () 2 1 f ring c 7 () 2 ------------------------------- + = caller id data ring cid first ring signal levels not to scale second ring 2s 500 ms 3s 475 ms 2s gain cid db () 20 6 r 3 2 r 6 r 3 + () 2 1 fc 7 () 2 ------------------- + ----------------------------------------------------------------- log =
CPC5610/cpc5611 12 www.clare.com rev. 9.0 rent. the photocurrent, a linear representation of the receive signal, is amplified and converted to a differen- tial voltage output on rx+ and rx-. variations in gain are controlled to within 1 db by an on-chip automatic gain control (agc) circuit, which sets the output of the photoamplifier to unity gain. to accommodate single-supply operation, litelink includes a small dc bias on the rx outputs of 1.0 vdc. most applications s hould ac couple the rx out- puts as shown in figure 6. litelink may be used for differential or single-ended output as shown in figure 6. single-ended use will produce 6 db less signal output amplitude. do not exceed 0 dbm into 600 ? (2.2 v p-p ) signal input. figure 6. differential and single-ended receive path connections to litelink 3.3.2 transmit signal path connect transmit signals from the host equipment to the tx+ and tx- pins of litelink. do not exceed a signal level of 0 dbm in 600 ? (or 2.2 v p-p ). differen- tial transmit signals are converted to single-ended sig- nals in litelink. the signal is coupled to the transmit photodiode amplifier in a similar manner to the receive path. the output of the photodiode amplifier is coupled to a voltage-to-current converter via a transconductance stage where the transmit signal modulates the tele- phone line loop current. as in the receive path, gain is set to unity automatically, li miting insertion loss to 0, 1 db. figure 7. differential and single-ended transmit path connections to litelink 3.4 dc characteristics the CPC5610 and cpc5611 are designed for world- wide application regarding dc characteristics, includ- ing use under the requirements of tbr-21. the zdc, dcs1, and dcs2 pins control the vi slope character- istics of litelink. selecting appropriate resistor val- ues for r zdc (r16) and r dcs (r15) in the provided application circuits assu re compliance with dc requirements. 3.4.1 resistive termination applications litelink includes a telephone line current limit fea- ture that is selectable by selecting the desired value for r zdc (r16) using the following formula: clare recommends using 8.2 ? for r zdc in north america and japan, limiting telephone line current to 133 ma. 3.4.2 reactive termination applications tbr-21 sets the telephone line current limit at 60 ma. to meet this requirement, set r zdc (r16) to 22.1 ? . see clare application note an-146 guidelines for effec- tive litelink designs for information on fet heat sink- ing in this application. rx+ rx- rx+ rx+ rx rx- 0.1uf 0.1uf 0.1uf litelink host-side codec or voice circuit litelink litelink txa1 txa2 - + 0.1uf 0.1uf host codec or transmit circuit host codec or transmit circuit tx- tx+ txa1 - + 0.1uf 0.1uf tx- tx+ i cl amps 1 v r zdc ------------- 0.011 a + =
CPC5610/cpc5611 rev. 9.0 www.clare.com 13 3.5 ac characteristics 3.5.1 resistive termination applications north american and japanese telephone line ac ter- mination requirements are met with a resistive 600 ? ac termination. receive termination is applied to the litelink znt pin (pin 29) as a 301 ? resistor, r znt (r10). a 150 ? resistor, r18 (r ztx ), applied to the litelink ztx pin (pin 30) sets the correct transmit gain and impedance. 3.5.2 reactive termination applications many areas use a single-pole complex impedance to model the telephone network transmission line char- acteristic impedance as shown in the table below. matching a complex impedance requires the use of complex networks on znt and ztx. in order to accommodate high power levels, it is necessary to modify the transmit and receiv e gain characteristics of your litelink implementation. the complex network on the ztx pin increases transmit gain by 7 db. a 7 db pad may be inserted before the tx+ and tx- pins to provide overall unity gain. similarly, with a complex network, the ratio of r12 (r ntf ) and r13 (r nts ) must be modified from 1:1 to 1:.287, which introduces a 7 db loss in the receive path from tip and ring to znt. 4. regulatory information litelink can be used to build products that comply with the requirements of tia/eia/is-968 (formerly fcc part 68), fcc part 15b, tbr-21, en60950, ul1950, en55022b, iec950/iec60950, cispr22b, en55024, and many other standards. litelink com- plies with the requirements of ul1577. litelink pro- vides supplementary isolation. metallic surge requirements are met through the inclusion of a sidac- tor in the application circuit. longitudinal surge protec- tion is provided by litelinks optical-across-the- barrier technology and the use of high-voltage compo- nents in the application circuit as needed. the information provided in this document is intended to inform the equipment designer but it is not sufficient to assure proper system design or regulatory compli- ance. since it is the equipment manufacturer's respon- sibility to have their equipment properly designed to conform to all relevant regulations, designers using litelink are advised to carefully verify that their end- product design complies with all applicable safety, emc, and other relevant standards and regulations. semiconductor components are not rated to withstand electrical overstress or elec tro-static discharges result- ing from inadequate protection measures at the board or system level. line impedance model tbr-21 australian ra 750 820 rb 270 220 c 150 nf 120 nf
CPC5610/cpc5611 14 www.clare.com rev. 9.0 5. litelink design resources 5.1 clare, inc. design resources the clare, inc. web site has a wealth of information useful for designing with litelink, including applica- tion notes and reference designs that already meet all applicable regulatory requirements. litelink data sheets also contains addi tional application and design information. see the following links: litelink datasheets and reference designs application note an-107 locxx series - isolated ampli- fier design principles application note an-114 itc117p application note an-117 customize caller-id gain and ring detect voltage threshold for CPC5610/11 application note an-140, understanding litelink application note an-141, enhanced pulse dialing with litelink application note an-143, loop reversal detection with litelink application note an-146, guidelines for effective litelink designs application note an-147, worldwide application of litelink application note an-149, increased litelink ii transmit power application note an-150, ground-start supervision cir- cuit using iaa110 5.2 third party design resources the following also contain information useful for daa designs. all of the books are available on ama- zon.com . understanding telephone electronics , stephen j. big- elow, et. al., butterworth-heinemann; isbn: 0750671750 newtons telecom dictionary , harry newton, cmp books; isbn: 1578200695 photodiode amplifiers: op amp solutions , jerald graeme, mcgraw-hill professional publishing; isbn: 007024247x teccor, inc. surge protection products united states code of federal regulations , cfr 47 part 68.3
CPC5610/cpc5611 rev. 9.0 www.clare.com 15 6. litelink performance the following graphs show litelink performance using the north american application circuit shown in this data sheet. figure 8. receive frequency response at rx figure 9. transmit frequency response at tx figure 10. receive thd on rx figure 11. transmit thd on tip and ring +3 +2.5 +2 +1.5 +1 +0.5 -0 -0.5 -1 -1.5 -2 -2.5 -3 -3.5 -4 -4.5 -5 gain (dbm) 20 50 100 200 500 1k 2k 4k frequency (hz) +3 +2.5 +2 +1.5 +1 +0.5 -0 -0.5 -1 -1.5 -2 -2.5 -3 -3.5 -4 -4.5 -5 gain (dbm) 20 50 100 200 500 1k 2k 4k frequency (hz) frequency (hz) db frequency (hz) db
CPC5610/cpc5611 16 www.clare.com rev. 9.0 figure 12. trans-hybrid loss figure 13. return loss figure 14. snoop circuit frequency response figure 15. snoop circuit thd + n figure 16. snoop circuit common mode rejection -45 -40 -35 -30 -25 -20 -15 300 800 1300 1800 2300 2800 3300 frequency (hz) thl (db) without c18 with c18 30 35 40 45 50 55 60 0 500 1000 1500 2000 2500 3000 3500 4000 frequency (hz) re t u r n loss (db) -25 -20 -15 -10 -5 0 5 0 500 1000 1500 2000 2500 3000 3500 4000 frequency (hz) gain (dbm ) 500 1k 1.5k 2k hz 2.5k 3k 3.5k 4k +0 -2.5 -5 -7.5 -10 -12.5 -15 -17.5 -20 -22.5 -25 -27.5 -30 -32.5 -35 -37.5 -40 -42.5 -45 -47.5 -50 -52.5 -55 -57.5 -60 cmrr (dbm) 50 20 100 200 500 1k 2k 4k frequency (hz)
CPC5610/cpc5611 rev. 9.0 www.clare.com 17 7. manufacturing information 7.1 mechanical dimensions figure 17. dimensions figure 18. recommended printed circuit board layout 10.287 + .254 (0.405 + 0.010) 7.493 + 0.127 (0.295 + 0.005) 10.363 + 0.127 (0.408 + 0.005) 4 max. 32 pl 7.239 + 0.051 (0.285 + 0.002) 0.203 (0.008) 1.016 typ. (0.040 typ.) 0.635 x 45 (0.025 x 45) 0.635 + 0.076 (0.025 + 0.003) 0.330 + 0.051 (0.013 + 0.002) 9.525 + 0.076 (0.375 + 0.003) 2.134 max. (0.084 max.) 1.981 + 0.051 (0.078 + 0.002) 0.051 + 0.051 (0.002 + 0.002) coplanar to a 0.08/(0.003) 32 pl. a dimensions mm (inches) 11.380 (0.448) 1.650 (0.065) 9.730 (0.383) 0.330 (0.013) 0.635 (0.025)
7.2 tape and reel packaging figure 19. tape and reel dimensions 7.3 soldering 7.3.1 moisture reflow sensitivity clare has characterized the moisture reflow sensitivity of litelink using ipc/jedec standard j-std-020a. moisture uptake from atmospheric humidity occurs by diffusion. during the solder reflow process, in which the component is attached to the pcb, the whole body of the component is exposed to high process tempera- tures. the combination of moisture uptake and high reflow soldering temperatures may lead to moisture induced delamination and cracking of the component. to prevent this, this component must be handled in accordance with ipc/jedec standard j-std-020a per the labeled moisture sensitivity level (msl), level 3. 7.3.2 reflow profile the maximum ramp rates, dwell times, and tempera- tures of the assembly refl ow profile should not exceed those specified in ipc/jedec standard j-std-020a, which were used to determine the moisture sensitivity level of this component. 7.4 washing clare does not recommend ul trasonic cleaning of this part. dimensions mm (inches) 330.2 dia. (13.00) top cover tape thickness .102 max. (.004) 12.090 (.476) embossed carrier embossment 6.731 max. (.265) .406 max. (.016) top cover tape 3.20 (.126) 2.70 (.106) 7.493 .102 (.295 .004) 1.753 .102 (.069 .004) 2.007 .102 (.079 .004) 1.498 .102 (.059 .004) 3.987 .102 (.157 .004) feed direction 11.989 .102 (.472 .004) 10.897 .025 (.429 .001) 1.549 .102 (.061 .004) 10.693 .025 (.421 .001) 16.002 .305 (.630 .012) .050r typ. for additional information please visit www.clare.com clare, inc. makes no representations or warranties with respect to the accuracy or completeness of the contents of this publica tion and reserves the right to make changes to specifications and product descriptions at any time without notice. neither circuit patent lice nses or indemnity are expressed or implied. except as set forth in clares standard terms and conditions of sale, clare, inc. assumes no liability whatsoever, and disclaims any express or implied warranty relating to its products, including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringe ment of any intellectual property right. the products described in this document are not designed, inten ded, authorized, or warranted for use as components in systems i ntended for surgical implant into the body, or in other applications intended to support or sustain life, or where malfunction of clares product may result in d irect physical harm, injury, or death to a person or severe property or environmental damage. clare, inc. rese rves the right to discontinue or make changes to its product s at any time without notice. specification: ds-CPC5610/cpc5611-r9.0 copyright ? 2002, clare, inc. all rights reserved. printed in usa. 6/27/2002

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